| 1994-01 | Annealing effects on the properties of TiW/WNx bilayer. | 김용태; D. J. Kim; C. S. Kwon; J. W. Park; 민석기 |
| 1993-01 | Atomic force microscopic observation in the surface morphologies and roughness of plasma deposited tungsten and tungsten nitride thin films. | Kim Yong Tae; C. S. Kwon; I. H. Choi; C. W. Lee; Min Suk-Ki |
| 1994-01 | Characteristics of RF magnetron sputtered (Ba, Sr)TiO//3 thin films on RuO//2 bottom electrode. | Kim Yong Tae; J. G. Lee; H. N. Lee; C. S. Kwon; S. H. Choh; Min Suk-Ki |
| - | Characteristics of RuOx thin films as a sacrificial diffusion barrier for Cu metallization | Kim Yong Tae; H. S. Yoon; C. S. Kwon; H. N. Lee; J. Jang; Min Suk-Ki |
| 1994-01 | Comparison of high temperature thermal stability of Ru and RuO//2 schottky contact to GaAs. | Kim Yong Tae; S. K. Kwak; C. W. Lee; J. G. Lee; C. S. Kwon; K. S. Jung; Min Suk-Ki |
| 1993-01 | Comparison of plasma deposited tungsten and tungsten nitride schottky contacts to GaAs. | Kim Yong Tae; S. J. Lee; C. S. Kwon; C. W. Lee; Min Suk-Ki |
| 1993-01 | Effects of nitrogen on the stress of plasma deposited tungsten and tungsten nitride thin films. | Kim Yong Tae; S. J. Lee; C. S. Kwon; Y. W. Park; C. C. Lee; C. W. Lee; Min Suk-Ki |
| 1995-01 | New concept for amorphous diffusion barrier: Ion beam modification of metal/semiconductor interface. | Kim Yong Tae; S. K. Kwak; C. S. Kwon; D. J. Kim; C. W. Lee; I. H. Choi; Min Suk-Ki |
| 1994-01 | Nitrogen implanted tungsten thin films for Cu diffusion barrier. | Kim Yong Tae; D. J. Kim; C. S. Kwon; I. H. Choi; Min Suk-Ki |
| 1994-01 | Post annealing characteristics of RF magnetron sputtered PbTiO//3 films. | Kim Yong Tae; H. N. Lee; J. G. Lee; C. S. Kwon; S. H. Choh; Min Suk-Ki |
| - | Study on physical properties of Cu-CVD for ULSI interconnects. | Kim Yong Tae; Y. S. Kim; S. K. Kwak; C. S. Kwon; D. G. Jung; Min Suk-Ki |
| 1995-01 | The characteristics of nitrogen implanted tungsten film as a new diffusion barrier for metal organic chemical vapor deposited Cu metallization. | 김용태; 민석기; C. S. Kwon; I. H. Choi |
| - | The properties of nitrogen implanted tungsten diffusion barrier for Cu metallization. | Kim Yong Tae; C. S. Kwon; D. J. Kim; J. Y. Lee; I. H. Choi |
| 1995-01 | The properties of nitrogen implanted tungsten diffusion barrier for Cu metallization. | 김용태; C. S. Kwon; D. J. Kim; J. Y. Lee; I. H. Choi |
