| - | P-28:Flat lamp packaging using carbon-nitrogen nanofibers obtained by hot Isostatic pressure. | 이양두; 이덕궁; Ju Byeong Kwon; V.D.Blank; D.V.Batov; S.G.Buag; 남산; LEE YUN HI; OH MYUNG HWAN |
| - | P-30:The effects of a thermal treated Au on the porous polycrystalline silicon nano-structured emitter. | 이주원; Kim Hun; 김종무; Ju Byeong Kwon; LEE YUN HI; 장진; OH MYUNG HWAN |
| - | P-89:Passivation properties of inorganic films for flexible OLEDs | Kim Hun; Kim Kwang Ho; 구홍모; Kim Jai Kyeong; Ju Byeong Kwon; 도이미; 오영환; 장진 |
| - | P-8:Hydrogen plasma treatment on the electrical characteriazation of inverted staggered pentacene thin film transistors | 장재원; Kim Hun; 김종무; Kim Jai Kyeong; Kim Young Chul; Ju Byeong Kwon; LEE YUN HI; 장진 |
| - | P-90:Permeation properties of inorganic thin-film and its applicaton to PM-OLED using electron beam evaporation system | Kim Kwang Ho; Kim Hun; 구홍모; Kim Jai Kyeong; Kim Young Chul; Ju Byeong Kwon; 한정인; 문대규; 장진 |
| - | Packaging of OLED using Si-cap structure | 조원준; 장재원; Kim Jai Kyeong; 김상식; 장진; LEE YUN HI; Ju Byeong Kwon |
| - | Packaging of the MEMS devices using thin silicon wafer | 박윤권; 김용국; Kim Hun; LEE YUN HI; 김철주; Ju Byeong Kwon |
| - | Packaging of the RF-MEMS switch | 박흥우; 이덕중; 박윤권; 김철주; PARK JEONG HO; 서용교; 김정우; SONG CI MOO; OH MYUNG HWAN; Ju Byeong Kwon |
| - | Packaging of the vacuum magnetic field sensors | 박흥우; 이덕중; PARK JEONG HO; OH MYUNG HWAN; Ju Byeong Kwon |
| - | Packaging of vacuum microelectronic device using electrostatic bonding | Ju Byeong Kwon; 이덕중; OH MYUNG HWAN |
| - | Patterning 된 전극을 이용한 4 인치 Glass-to-Silicon wafer 의 정전 열 접합 . | 이덕중; Ju Byeong Kwon; LEE YUN HI; 정지원; 장진; OH MYUNG HWAN |
| - | PDP tubeless packaging by using epoxy gluing process at room temperature | Seung-Il Moon; Duck-Jung Lee; OH MYUNG HWAN; LEE YUN HI; Ju Byeong Kwon; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim |
| - | PDP tubeless packaging using B-stage epoxy | Seung-Il Moon; Duck-Jung Lee; OH MYUNG HWAN; LEE YUN HI; Ju Byeong Kwon; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim |
| - | Permeation properties of composite thin film for organic based electronic devices. | Kim Kwang Ho; Kim Hun; 이주원; Kim Jai Kyeong; Ju Byeong Kwon; 장진; OH MYUNG HWAN; 한정인 |
| - | Relationship between the shape of KOH-etched bonding interface and the interfacial oxide condition in silicon direct bonding | Ju Byeong Kwon; 차균현; OH MYUNG HWAN |
| - | RF-MEMS package with vertical via hole for low loss characteristic | Yun-Kwon Park; Heung-Woo Park; Duck-Jung Lee; Jung-Ho Park; Chung-Woo Kim; Ci-Moo Song; Chul-Ju Kim; Ju Byeong Kwon |
| - | Si micromachining for MEMS-IR sensor application | 박흥우; Ju Byeong Kwon; 박윤권; PARK JEONG HO; 김철주; Sang-Seop Yom; SUH SANG HEE; OH MYUNG HWAN |
| - | Silicon to silicon anodic bonding using lithium doped interlayer | 정지원; Ju Byeong Kwon; 최우범; 정성재; LEE NAM YANG; CHOI DOO JIN; OH MYUNG HWAN |
| - | Silicon-to-silicon electrostatic bonding using lithia-silicate glass interlayer | 정지원; Ju Byeong Kwon; CHOI DOO JIN; OH MYUNG HWAN |
| - | Single crystalline silicon thin film transistor using SOI wafer for the switching device of top emission type AMOLEDs. | 장재원; Kim Hun; Kim Jai Kyeong; LEE YUN HI; Ju Byeong Kwon |
| - | Single crystalline thin film transistor using SOI wafer for the switching device of top emission type AMOLEDs | 장재원; Kim Hun; Kwang-Ho Kim; Kim Jai Kyeong; LEE YUN HI; 장진; Ju Byeong Kwon |
| - | Small graphic white-light emitting ZnS:Pr,Ce TFEL displays | LEE YUN HI; KIM YOUNG SIK; Ju Byeong Kwon; 정성재; LEE NAM YANG; OH MYUNG HWAN |
| - | SOI 웨이퍼를 이용한 압전박막 공진기의 설계 및 제작 | KIM IN TAY; 박윤권; 이시형; LEE YUN HI; Lee Jeon Kook; 김남수; Ju Byeong Kwon |
| - | Status and new evaluation method of interfacial oxide between directly-bonded Si wafer pairs | Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN |
| - | Strip-shaped diamond field emitter arrays fabricated by transfer mold technique for FED applications | LEE YUN HI; OH MYUNG HWAN; Ju Byeong Kwon; S. J. Kim; B. S. Park; Y. J. Baik; S. K. Lim |
| - | Structure and field emission properties of carbon - nitrogen (CN) nanofibers obtained by hot isostatic pressure | 이양두; V.D. Blank; D.V. Batov; S.G. Buga; 남산; LEE YUN HI; Ju Byeong Kwon |
| - | Structure and morphology of vacuum-evaporated pentacene as a function of the evaporation rate and substrate temperature | 장재원; Kim Hun; Kwang-Ho Kim; Kim Jai Kyeong; LEE YUN HI; 장진; Ju Byeong Kwon |
| - | Study on glass-to-silicon anodic bonding using hydrophilic process | Ju Byeong Kwon; 이덕중; 장진; OH MYUNG HWAN |
| - | Study on pre-bonding according with HF pre-treatment conditions in Si wafer direct bonding | 강경두; 박진성; 정수태; Ju Byeong Kwon; 정귀상 |
| - | Study on the batch fabrication of silicon diaphragms | 하병주; Ju Byeong Kwon; 차균현; OH MYUNG HWAN; 김철주 |
