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Results 1-10 of 12 (Search time: 0.003 seconds).
Item hits:
Issue Date
Title
Author(s)
-
(Undefined)
Ju Byeong Kwon
;
강경두
;
정수태
;
Jung Jae Hoon
;
정귀상
-
The effect of 02 plasma treatment on anodic bonding
Ju Byeong Kwon
;
최승우
;
최우범
;
LEE YUN HI
;
KIM BYUNG HO
;
OH MYUNG HWAN
-
Study on glass-to-silicon anodic bonding using hydrophilic process
Ju Byeong Kwon
;
이덕중
;
장진
;
OH MYUNG HWAN
-
Glass-to-glass bonding for tubeless packaging of field emission display
Ju Byeong Kwon
;
최우범
;
이덕중
;
정지원
;
정성재
;
LEE NAM YANG
;
조경익
;
유형준
;
한정인
;
OH MYUNG HWAN
-
(Undefined)
Ju Byeong Kwon
;
강경두
;
박진성
;
정수태
;
정귀상
-
Effect of wet-etching process on the gate insulator of metal tip FEA
정유호
;
Ju Byeong Kwon
;
Jung Jae Hoon
;
LEE YUN HI
;
OH MYUNG HWAN
;
김철주
-
Silicon to silicon anodic bonding using lithium doped interlayer
정지원
;
Ju Byeong Kwon
;
최우범
;
정성재
;
LEE NAM YANG
;
CHOI DOO JIN
;
OH MYUNG HWAN
-
Modified low-temperature direct bonding method for vacuum microelectronics application
Ju Byeong Kwon
;
이덕중
;
최우범
;
장진
;
LEE YUN HI
;
이광배
;
OH MYUNG HWAN
-
New Vacuum packaging method of field emission display
Ju Byeong Kwon
;
최우범
;
S. J. Jeong
;
LEE NAM YANG
;
J. I. Han
;
K. I. Cho
;
OH MYUNG HWAN
-
Status and new evaluation method of interfacial oxide between directly-bonded Si wafer pairs
Ju Byeong Kwon
;
LEE YUN HI
;
OH MYUNG HWAN
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OH MYUNG HWAN
5
최우범
4
LEE YUN HI
3
LEE NAM YANG
3
강경두
3
이덕중
3
정귀상
3
정수태
2
Jung Jae Hoon
2
장진
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-Subject
3
FED
2
MEMS
2
tubeless packaging
2
vacuum microelectronics
1
annealing
1
elemental semiconductors
1
etching
1
interface structure
1
materials testing
1
micromachining
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