2001-09 | Fabrication and packaging of the vacuum magnetic field sensor | 박흥우; 박윤권; 이덕중; 김철주; 박정호; 오명환; 주병권 |
- | Fabrication of Si, Mo tip FEAs and FED application | Ju Byeong Kwon; 이상조; Kim Hun; 이덕중; OH MYUNG HWAN |
- | FED Tubeless packaging by vacuum-electrostatic bonding | Ju Byeong Kwon; 이덕중; 정지원; 안준호; Kim Hun; OH MYUNG HWAN |
- | Flat lamp fabrication using CNTs grown on glass substrate | 이양두; 이덕중; LEE YUN HI; 유재은; 박정훈; 김봉철; Ju Byeong Kwon |
- | Glass-to glass wafer anodic bonding and its application to FEA/FED micro-packaging | Ju Byeong Kwon; 이덕중; 정지원; OH MYUNG HWAN; 정성재; LEE NAM YANG; 고영욱; LEE CHOONG HOON; 한정인; 조경익; CHOI DOO JIN |
- | Glass-to-glass bonding for tubeless packaging of field emission display | Ju Byeong Kwon; 최우범; 이덕중; 정지원; 정성재; LEE NAM YANG; 조경익; 유형준; 한정인; OH MYUNG HWAN |
1998-08 | Improvement of bonding properties by pre-bonding at room temperature in Si-glass electrostatic bonding process | 주병권; 이덕중; 이윤희; 이남양; 한정인; 조경익; 오명환 |
2002-11 | Low temperature sealing of plasma display panel using organic material | 문승일; 이덕중; 김영조; 이윤희; 주병권 |
2005-12-09 | MEMS 구조물을 이용한 탄소나노튜브 가스센서 및 그 제작방법 | 주병권; 이덕중; 이곤재; 오동환; 강종윤; 이윤희; 장윤택; 문승일; 이종홍 |
- | Modified low-temperature direct bonding method for vacuum microelectronics application | Ju Byeong Kwon; 이덕중; 최우범; 장진; LEE YUN HI; 이광배; OH MYUNG HWAN |
- | Multi-substrate bonding using anodic bonding method | Ju Byeong Kwon; 이덕중; 최우범; 한정인; 조경인; 이광배; 장진; OH MYUNG HWAN |
- | New vacuum packaging using wire-heater and optical fiber spacer for FED | 이덕중; Ju Byeong Kwon; OH MYUNG HWAN; 장진; LEE YUN HI |
- | Packaging of the RF-MEMS switch | 박흥우; 이덕중; 박윤권; 김철주; PARK JEONG HO; 서용교; 김정우; SONG CI MOO; OH MYUNG HWAN; Ju Byeong Kwon |
- | Packaging of the vacuum magnetic field sensors | 박흥우; 이덕중; PARK JEONG HO; OH MYUNG HWAN; Ju Byeong Kwon |
- | Packaging of vacuum microelectronic device using electrostatic bonding | Ju Byeong Kwon; 이덕중; OH MYUNG HWAN |
- | Patterning 된 전극을 이용한 4 인치 Glass-to-Silicon wafer 의 정전 열 접합 . | 이덕중; Ju Byeong Kwon; LEE YUN HI; 정지원; 장진; OH MYUNG HWAN |
2001-01 | PDP tubeless packaging process using glass-to-glass vacuum-electrostatic bonding | 주병권; 이덕중; 정진욱; 문권진; 김영조; 이윤희 |
1999-09 | Si-to-Si electrostatic bonding using LSG film as an interlayer | 주병권; 정지원; 이덕중; 이윤희; 최두진; 오명환 |
1999-09 | Sodalime-sodalime electrostatic bonding using amorphous silicon interlayer and its application to FEA packaging | 주병권; 이덕중; 최우범; 김영조; 이남양; 오명환 |
- | Study on glass-to-silicon anodic bonding using hydrophilic process | Ju Byeong Kwon; 이덕중; 장진; OH MYUNG HWAN |
- | Study on tubeless packaging of plasma display panel | 정진욱; 김영조; 이덕중; 최은하; 문권진; 김준동; Ju Byeong Kwon |
- | Study on vacuum packaging of field emission display | 이덕중; Ju Byeong Kwon; 장진; OH MYUNG HWAN |
- | Surface-micromachined vacuum magnetic field sensors | Ju Byeong Kwon; 박흥우; 이덕중; PARK JEONG HO; OH MYUNG HWAN |
- | Technical improvement of FED tubeless packaging | Ju Byeong Kwon; 이덕중; 최우범; 정성재; LEE NAM YANG; 조경익; LEE YUN HI; 성만영; OH MYUNG HWAN |
1999-12 | Technical improvement of FED tubeless packaging | 주병권; 이덕중 |
- | Thin PDP packaging by glass-bonding techonlogy and its driving properties | 이덕중; Ju Byeong Kwon; 정진욱; 박흥우; LEE YUN HI; 김영조; 조태성; 최은하; 장진; OH MYUNG HWAN |
- | Thin PDP packaging technology in low temperature and emission characteristics | Ju Byeong Kwon; 이덕중; 정진욱; 김영조; 최은하; 장진; OH MYUNG HWAN |
- | Tubeless packaging of field emission display using glass to glass electrostatic bonding technology | 정지원; Ju Byeong Kwon; 이덕중; LEE YUN HI; N. Y. Lee; Y. W. Ko; Y. G. Moon; CHOI DOO JIN; OH MYUNG HWAN |
- | Vacuum in-line PDP sealing in low temperature by organic materials | 이덕중; 문권진; 김준동; 송치호; 장진; OH MYUNG HWAN; Ju Byeong Kwon |
- | Vacuum packaging and operating properties of micro-tunneling sensors | Ju Byeong Kwon; 박흥우; 이덕중; SON YONG BAE; PARK JEONG HO; OH MYUNG HWAN |