| - | A novel wafer level packaging of the RF-MEMS devices with low loss | 박윤권; 이덕중; 박흥우; 송인상; 김정우; SONG CI MOO; LEE YUN HI; 김철주; Ju Byeong Kwon |
| - | A tubeless AC-plasma display panel(PDP) packaged by electrostatic bonding technology | 이덕중; Ju Byeong Kwon; 정진욱; 김영조; 최은하; KIM TEA YOUNG; 장진; LEE YUN HI |
| - | Development of flat type back-lamp using carbon nano tubes grown on glass substrate | 이양두; 이덕중; 박정훈; 유재은; LEE YUN HI; 장진; Ju Byeong Kwon |
| - | Development of in-line sealing method for plasma display panel | 이덕중; LEE YUN HI; Ju Byeong Kwon; 문건진; 김준동; OH MYUNG HWAN; 장진 |
| - | Development of spacer formation method using anodic bonding technique for field emission display | 강문식; 장윤택; 이덕중; Ju Byeong Kwon; 이내성; KIM JONG MIN; 유건호; OH MYUNG HWAN; LEE YUN HI |
| 1999-04 | Development of tubeless-packaged field emission display | 주병권; 이덕중; 이윤희; 오명환 |
| 1998-07 | Electrostatic bonding between two ITO-coated glass for FED tubeless packaging applications | 주병권; 이덕중; 정지원; 이윤희; 이남양; 한정인; 조경익; 오명환 |
| - | Electrostatically vacuum sealed tunneling magnetic sensors | 박흥우; Ju Byeong Kwon; 이덕중; PARK JEONG HO; OH MYUNG HWAN |
| - | Evaluation of carbon nanotubes as gas sensing materials micro gas sensors. | Moon, Seung IL; 이덕중; 장윤택; Soo-Won Kim; LEE YUN HI; Ju Byeong Kwon |
| 2001-09 | Fabrication and packaging of the vacuum magnetic field sensor | 박흥우; 박윤권; 이덕중; 김철주; 박정호; 오명환; 주병권 |
| - | Fabrication of Si, Mo tip FEAs and FED application | Ju Byeong Kwon; 이상조; Kim Hun; 이덕중; OH MYUNG HWAN |
| - | FED Tubeless packaging by vacuum-electrostatic bonding | Ju Byeong Kwon; 이덕중; 정지원; 안준호; Kim Hun; OH MYUNG HWAN |
| - | Flat lamp fabrication using CNTs grown on glass substrate | 이양두; 이덕중; LEE YUN HI; 유재은; 박정훈; 김봉철; Ju Byeong Kwon |
| - | Glass-to glass wafer anodic bonding and its application to FEA/FED micro-packaging | Ju Byeong Kwon; 이덕중; 정지원; OH MYUNG HWAN; 정성재; LEE NAM YANG; 고영욱; LEE CHOONG HOON; 한정인; 조경익; CHOI DOO JIN |
| - | Glass-to-glass bonding for tubeless packaging of field emission display | Ju Byeong Kwon; 최우범; 이덕중; 정지원; 정성재; LEE NAM YANG; 조경익; 유형준; 한정인; OH MYUNG HWAN |
| 1998-08 | Improvement of bonding properties by pre-bonding at room temperature in Si-glass electrostatic bonding process | 주병권; 이덕중; 이윤희; 이남양; 한정인; 조경익; 오명환 |
| 2002-11 | Low temperature sealing of plasma display panel using organic material | 문승일; 이덕중; 김영조; 이윤희; 주병권 |
| 2005-12-09 | MEMS 구조물을 이용한 탄소나노튜브 가스센서 및 그 제작방법 | 주병권; 이덕중; 이곤재; 오동환; 강종윤; 이윤희; 장윤택; 문승일; 이종홍 |
| - | Modified low-temperature direct bonding method for vacuum microelectronics application | Ju Byeong Kwon; 이덕중; 최우범; 장진; LEE YUN HI; 이광배; OH MYUNG HWAN |
| - | Multi-substrate bonding using anodic bonding method | Ju Byeong Kwon; 이덕중; 최우범; 한정인; 조경인; 이광배; 장진; OH MYUNG HWAN |
| - | New vacuum packaging using wire-heater and optical fiber spacer for FED | 이덕중; Ju Byeong Kwon; OH MYUNG HWAN; 장진; LEE YUN HI |
| - | Packaging of the RF-MEMS switch | 박흥우; 이덕중; 박윤권; 김철주; PARK JEONG HO; 서용교; 김정우; SONG CI MOO; OH MYUNG HWAN; Ju Byeong Kwon |
| - | Packaging of the vacuum magnetic field sensors | 박흥우; 이덕중; PARK JEONG HO; OH MYUNG HWAN; Ju Byeong Kwon |
| - | Packaging of vacuum microelectronic device using electrostatic bonding | Ju Byeong Kwon; 이덕중; OH MYUNG HWAN |
| - | Patterning 된 전극을 이용한 4 인치 Glass-to-Silicon wafer 의 정전 열 접합 . | 이덕중; Ju Byeong Kwon; LEE YUN HI; 정지원; 장진; OH MYUNG HWAN |
| 2001-01 | PDP tubeless packaging process using glass-to-glass vacuum-electrostatic bonding | 주병권; 이덕중; 정진욱; 문권진; 김영조; 이윤희 |
| 1999-09 | Si-to-Si electrostatic bonding using LSG film as an interlayer | 주병권; 정지원; 이덕중; 이윤희; 최두진; 오명환 |
| 1999-09 | Sodalime-sodalime electrostatic bonding using amorphous silicon interlayer and its application to FEA packaging | 주병권; 이덕중; 최우범; 김영조; 이남양; 오명환 |
| - | Study on glass-to-silicon anodic bonding using hydrophilic process | Ju Byeong Kwon; 이덕중; 장진; OH MYUNG HWAN |
| - | Study on tubeless packaging of plasma display panel | 정진욱; 김영조; 이덕중; 최은하; 문권진; 김준동; Ju Byeong Kwon |
