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Showing results 1 to 30 of 37

Issue DateTitleAuthor(s)
-A novel wafer level packaging of the RF-MEMS devices with low loss박윤권; 이덕중; 박흥우; 송인상; 김정우; SONG CI MOO; LEE YUN HI; 김철주; Ju Byeong Kwon
-Analysis of electric field distribution and tunneling currents for field emitter arrayJung Jae Hoon; 김영훈; LEE BYONG HO; 박흥우; Ju Byeong Kwon; OH MYUNG HWAN
-Electrical characteristics of Mo-coated Si FEAJu Byeong Kwon; OH MYUNG HWAN; 박흥우; Jung Jae Hoon; PARK JEONG HO
-Electrostatically vacuum sealed tunneling magnetic sensors박흥우; Ju Byeong Kwon; 이덕중; PARK JEONG HO; OH MYUNG HWAN
-Etching-bonding-thin film deposition process for MEMS-IR SENSOR application박윤권; Ju Byeong Kwon; 박흥우; PARK JEONG HO; Sang-Seop Yom; SUH SANG HEE; OH MYUNG HWAN; 김철주
-Fabrication and characterization of diode-type Si field emitter array박흥우; Ju Byeong Kwon; Kim Sung Jin; Jung Jae Hoon; PARK JEONG HO; OH MYUNG HWAN
1997-04Fabrication and electrical characterization of molybdenum-coated silicon field emitters with a diode type박흥우; 주병권; 정재훈; 이윤희; 박정호; 오명환
2001-09Fabrication and packaging of the vacuum magnetic field sensor박흥우; 박윤권; 이덕중; 김철주; 박정호; 오명환; 주병권
-Fabrication of (100), (110), (111) Si tip using various wet etching method박흥우; Ju Byeong Kwon; KO CHANG GI; 홍순관; OH MYUNG HWAN; 김철주
2000-05Fabrication of micro-vacuum sensor using surface-macromachined lateral-type field emitter device박흥우; 주병권; 이윤희; 박정호; 오명환
-Fabrication of Si tips for field emission devicesJu Byeong Kwon; OH MYUNG HWAN; 박흥우; 하병주; 박재홍; 김철주
-Fabrication of un-cooled infrared sensor using pyroelectric thin film박윤권; Ju Byeong Kwon; 박흥우; Yoon Young Soo; Sang-Seop Yom; Oh Young-Jei; PARK JEONG HO; SUH SANG HEE; OH MYUNG HWAN; 김철주
-MEMS-IR sensor fabrication and characterizationJu Byeong Kwon; 박흥우; 박윤권; PARK JEONG HO; 김철주; Sang-Seop Yom; SUH SANG HEE; OH MYUNG HWAN
-Micro-tunneling sensor for vacuum level evaluation of field emission display박흥우; Ju Byeong Kwon; 박윤권; 김철주; OH MYUNG HWAN
-Micro-tunneling sensors for vacuum level evaluation of field emission display devices박흥우; Ju Byeong Kwon; 박윤권; 김철주; OH MYUNG HWAN
-Micromachining and fabrication of thin films for MEMS-infrared detectorsSang-Seop Yom; 박흥우; 박윤권; Ju Byeong Kwon; CHOI HYUN SEOK; Oh Young-Jei; LEE JONG HOON; CHUNG MOONKYO; SUH SANG HEE; OH MYUNG HWAN
2001-04Micromachining and fabrication of thin films for MEMS-infrared detectors염상섭; 박흥우; 박윤권; 주병권; 오영제; 이종훈; 정문교; 서상희; 황근창
-Packaging of the RF-MEMS switch박흥우; 이덕중; 박윤권; 김철주; PARK JEONG HO; 서용교; 김정우; SONG CI MOO; OH MYUNG HWAN; Ju Byeong Kwon
-Packaging of the vacuum magnetic field sensors박흥우; 이덕중; PARK JEONG HO; OH MYUNG HWAN; Ju Byeong Kwon
-Si micromachining for MEMS-IR sensor application박흥우; Ju Byeong Kwon; 박윤권; PARK JEONG HO; 김철주; Sang-Seop Yom; SUH SANG HEE; OH MYUNG HWAN
1998-10Si micromachining for MEMS-IR sensor application박흥우; 주병권; 박윤권; 박정호; 김철주; 염상섭; 서상희; 오명환
-Surface-micromachined vacuum magnetic field sensorsJu Byeong Kwon; 박흥우; 이덕중; PARK JEONG HO; OH MYUNG HWAN
-The effect of wet-etching process on the gate insulator for fabrication of metal tip FEAJu Byeong Kwon; 정유호; Jung Jae Hoon; 박흥우; 송만호; 김철주; LEE YUN HI; OH MYUNG HWAN
-Thin PDP packaging by glass-bonding techonlogy and its driving properties이덕중; Ju Byeong Kwon; 정진욱; 박흥우; LEE YUN HI; 김영조; 조태성; 최은하; 장진; OH MYUNG HWAN
-Vacuum packaging and operating properties of micro-tunneling sensorsJu Byeong Kwon; 박흥우; 이덕중; SON YONG BAE; PARK JEONG HO; OH MYUNG HWAN
-Wafer level sealing technology of MEMS devices using B-stage epoxy박흥우; 박윤권; 이덕중; 김철주; PARK JEONG HO; 서용교; 김정우; SONG CI MOO; OH MYUNG HWAN; Ju Byeong Kwon
-전자선 증착된 실리콘 산화막 층을 이용한 직접 접합에 관한 연구 .Ju Byeong Kwon; 박흥우; LEE YUN HI; 정성재; LEE NAM YANG; 고근하; M.R. Haskard; PARK JEONG HO; OH MYUNG HWAN
1999-09-15중간　삽입층을　이용한　직접　접합　공정과　이를　이용하는　전계방출　소자의진공실장공정　및　실리사이드　제조공정주병권; 오명환; 박흥우
-(Undefined)Ju Byeong Kwon; 박흥우; 이덕중; 서상원; 김남수; PARK JEONG HO; OH MYUNG HWAN
-(Undefined)Ju Byeong Kwon; 박흥우; 이덕중; PARK JEONG HO; OH MYUNG HWAN
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