| - | Reliability modeling of MEMS probe card with vertical guide | Bong-Hwan Kim; Sewan Park; Kyuhwan Jung; Na, Kyounghwan; Yoon, Eui Sung |
| - | Reliable design and characterization of MEMS probe tip | SeungHun LEE; Chu sung il; Kim, Jin Hyeck; Seo Ho Won; Dong-Chul Han; Moon, Sung Wook |
| 2007-03 | Reliable design and electrical characteristics of vertical MEMS probe tip | 이승훈; 추성일; 김진혁; 한동철; 문성욱 |
| 2014-05-03 | Resonance frequency effects of an external coil for IOP sensor applications | Hwang, Hoyong; Kang, Byungjoo; Lee, Soo Hyun; Jang, Cheol-In; Kang, Ji Yoon; Park, Changkun |
| 1992-01 | Short consideration on the non-uniformities existing at the etched-edges in deep anisotropic etching of (100) silicon | 주병권; 하병주; 김철주; 오명환; 차균현 |
| - | Si micromachining for MEMS-IR sensor application | 박흥우; Ju Byeong Kwon; 박윤권; PARK JEONG HO; 김철주; Sang-Seop Yom; SUH SANG HEE; OH MYUNG HWAN |
| 1998-10 | Si micromachining for MEMS-IR sensor application | 박흥우; 주병권; 박윤권; 박정호; 김철주; 염상섭; 서상희; 오명환 |
| 1997-10 | Si-Si electrostatic bonding using electron beam-evaporated corning #7740 as an interlayer | 주병권; 최우범; 이윤희; 정성재; 이남양; 성만영; 오명환 |
| - | Silicon to silicon anodic bonding using lithium doped interlayer | 정지원; Ju Byeong Kwon; 최우범; 정성재; LEE NAM YANG; CHOI DOO JIN; OH MYUNG HWAN |
| 1999-01 | Silicon-to-indium tin oxide coated glass bonding for packaging of field emission arrays fabricated on silicon wafer | Choi, WB; Ju, BK; Lee, YH; Oh, MH; Lee, NY; Sung, MY |
| - | Silicon-to-silicon electrostatic bonding using lithia-silicate glass interlayer | 정지원; Ju Byeong Kwon; CHOI DOO JIN; OH MYUNG HWAN |
| 2000-03-15 | Simulation and fabrication of piezoresistive membrane type MEMS strain sensors | Cao, L; Kim, TS; Mantell, SC; Polla, DL |
| - | Spiral Type Piezoelectric MEMS Power Generator with Shear Mode | Song, Hyun - Cheol; KANG, CHONG YUN; YOON, SEOK JIN |
| - | Spiral type Piezoelectric MEMS power generator with shear mode | Song, Hyun - Cheol; KANG, CHONG YUN; YOON, SEOK JIN; Kim Hyung Chan |
| - | Streaming potential energy due to electrokinetic transport in multi-channel type microfluidic chip | Myung-Suk Chun; Kim, Ki Chul; Kim Il Tae |
| - | Surface-micromachined vacuum magnetic field sensors | Ju Byeong Kwon; 박흥우; 이덕중; PARK JEONG HO; OH MYUNG HWAN |
| 2015-03 | Synthesis and properties of UV curable polyvinylsilazane as a precursor for microstructuring | Li, Yi-He; Ahn, Kwang-Duk; Kim, Dong-Pyo |
| - | Synthesis and tribological behavior of nanocomposite polymer layers | V. V. Tsukruk; Ahn Hyo-Sok; D. Julthongpiput; Doo-In Kim |
| - | Templated ink jet printing for MEMS | LEE, HEON JU; LEE, Hyoung-Woo; KIM, SANG-GOOK |
| 2001-11 | The fabrication of microlens array | 문성욱; 김희연 |
| - | The influence of ambient gases on the emission characteristics of Mo-FEAs during the frit-sealing cycle | N. Y. Lee; 김봉철; Jung Jae Hoon; 강문식; H. Kim; Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; J. Jang; AN SE YOUNG |
| - | The influence of gate insulator etching on the characteristics of Mo-tip field-emitter arrays | H. Kim; Ju Byeong Kwon; S. Lee; LEE YUN HI; OH MYUNG HWAN; 고영욱; J. Jang |
| 2007-04 | The Korean Research & Development Program on Micro- Electro-Mechanical systems (MEMS) in medical applications | Kim, Tae Song; Kim, Sung June; Chung, Bong Hyun; Yoo, Kyung-Hwa; Park, Seon Hee |
| - | Topographically-Chemically Modified Silicon Surfaces as Tribological Candidates for Miniaturized (MEMS) Devices | Pham Duc Cuong; Arvind Singh; Na, Kyounghwan; Yang Sung Wook; Yoon, Eui Sung |
| - | Tubeless packaging of field emission display using glass to glass electrostatic bonding technology | 정지원; Ju Byeong Kwon; 이덕중; LEE YUN HI; N. Y. Lee; Y. W. Ko; Y. G. Moon; CHOI DOO JIN; OH MYUNG HWAN |
| - | Uncooled infrared sensor by MEMS technology | HAN YONG HEE; Kim Kun Tae; Shin, Hyun Joon; An Mi Suk; Kim, Shin Keun; Moon, Sung Wook; Choi In-Hoon; Oh Myung-Hwan |
| - | Vacuum packaging and operating properties of micro-tunneling sensors | Ju Byeong Kwon; 박흥우; 이덕중; SON YONG BAE; PARK JEONG HO; OH MYUNG HWAN |
| - | Vacuum packaging of field emitter array using electrostatically-bonded glass-Si-glass/glass-glass structure | Ju Byeong Kwon; 이덕중; 정지원; Kim Hun; 이상조; LEE NAM YANG; 장진; OH MYUNG HWAN |
| - | Vacuum sealing of field-emission arrays using field-assisted bonding method | 이덕중; Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; LEE NAM YANG; 한정인; 조경익; 장진 |
| - | V₂O5/V/V₂O5 based uncooled infrared detector by MEMS technology | 한용희; 허재성; 최인훈; KIM GEUN TAE; Shin Hyun Joon; 치엔; Moon Sung Wook |
